- Created on 11 April 2011
- Last Updated on 04 March 2014
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Friday, January 10, 2014
Flexible Computing for Personal Electronic Devices
Dr. Daniel Díaz Sánchez
The tutorial will explain and test an experimental framework for Android called Light Weight Map Reduce that pursues enabling Elastic Personal Computing, a refinement of the “Elastic Computing” concept that allows personal electronics to automatically distribute the load among devices constituting a computing fabric seamlessly.
The dream of flexible computing or computing utility has been pursued for a long time since it was first introduced and has now become a commercial reality with the name of Cloud Computing. However, current cloud systems allow accessing and manipulating resources that are located in a different place to the client device and the client device does not participate. They usually require the data to be placed near the processing power (large data centers).
The way client devices interact with the system is similar to the old-fashioned mainframes, there is single entry point that accepts requests and delivers the outcome, so the client device is just a client and not part of the process. Thus, current clouds provide only part of the dream of flexible computing.
This tutorial will explain and demonstrate how to use a framework to let devices to automatically discover resources, manage them and distribute the load among devices constituting a computing fabric seamlessly.
For instance, a group of friends that have stored some pictures from a recent travel in their mobile phones could make a presentation with those pictures distributing the work among their mobile phones reducing the time it takes to process the pictures and keeping their privacy avoiding data centers to store personal data.
The core of the tutorial will describe an experimental framework for Android called Light Weight Map Reduce (LWMR) that enables the Elastic Personal Computing (EPC). EPC is a refinement of the Elastic Computing concept intended to provide such a computing fabric distributing the work load among consumer electronics belonging to a single, many individuals or even relying on shared "environment resources".
Topics covered on this tutorial:
1. Introduction to distributed computing for small devices
-Scenarios of application
-Problems and challenges
2. Analysis of the state of the art: most prominent efforts on this direction
3. A practical approach to distributed computing, the LWMR framework
Daniel Díaz Sánchez obtained his Telecommunication Engineering Degree from Carlos III University of Madrid in 2003. He joined the Telematic Engineering Department in 2004 as a researcher cooperating with Pervasive Computing Laboratory team in some European Projects as Ubisec and Trust-es. He continued with his research activities while he prepared his MsC and Ph.D degree. He obtained the MSC degree in Telematics in 2006 and his Ph.D in 2008. Now he is an associate professor of the Telematic Engineering Department.
In 2009 he was given an especial PhD award from Universidad Carlos III and the best Ph.D thesis award on electronic commerce from La Caixa as part of the awards promoted by the Official Telecommunication Engineering Association. Daniel is a member of IEEE, awarded with IEEE Chester Sall award, and co-author of more than 50 international publications. Among these publications are contributions to Computer Networks, Telecommunication System Journal and Transactions on Consumer Electronics. Besides, he contributed also to several conferences organized by IEEE, ACM and IFIP.
He contributed as a researcher in some European projects and local projects as those financed by Spanish Ministry or the state of Madrid. Among his other research activities, he cooperates with industry partners in technology transfer projects.
Dr. Sánchez’ research interests are focused on Pervasive Computing Security. The aim is to provide a seamless secure interaction infrastructure for personal limited devices, to overcome security protocol limitations, especially for content protection, and to provide service enablers to access services in a secure fashion in high distributed networks (Identity management with a special focus on user-centric Id).
The Power and Thermal Challenges for Smart Mobile Devices: from smartphones to wearable mobile devices
Dr. Hwisung Jung
A close look at today’s smart mobile devices (i.e., smartphones and tablets) usage reveals that extending battery life has become a daunting, yet vital, task necessary for delivering a rich user experience. Such necessity, coupled with the ongoing advance in SoC (System-on-Chip) and the explosive growth for mobile device applications, makes managing power and thermal conditions ever more challenging. Furthermore, optimizing power consumption for wearable consumer electronics products (e.g., smartwatches) is becoming one of the primary development challenges of these devices. One solution is to devise an intelligent power management policy that can quickly analyze quantifiable features of mobile devices under considerations and accurately predict the system performance, which can subsequently be used to find the optimal power management technique. In this tutorial, the various challenges of power modeling, analysis, and estimation for such devices are reviewed, and some of power and thermal management techniques are discussed.
Dr. Hwisung Jung is a principal scientist of Broadcom Corporation, CA, where he is responsible for the development of low power solutions for cellular system-on-chip. His current research interests include system/architecture-level power modeling/estimation/optimization, power/thermal management architecture/algorithms, and low power design methodology for battery-powered mobile SoC. He has published more than 15 technical papers and articles as a first author in journals and conferences (including TVLSI, TCAD, DAC, DATE, ISLPED, etc.) in the areas of low power design and power/thermal management architecture. He has worked in the semiconductor industries during the last 15 years, holding various positions at Broadcom, LG, Samsung, and Intel. Dr. Jung received his Ph.D. in electrical engineering from the University of Southern California. He is a member of IEEE and has been serving on the technical program committee of ISQED from 2008 to present.
Saturday, January 11, 2014
End-to-End 3D Video Transmission in Different Networks
Dr. Anil Fernando
It is clear from the history of 3D video, that while public popularityof the technology has waxed and waned, development of the technologyhas continued. The repeated revivals point to a real public interest in 3D technology.Previous failures have been caused by significant quality problems inthe production and projection of 3D movies, and a lack of good affordable 3Dtechnology for the home. While significant improvements in camera and projection technology havebeen made over the years, as well as the introduction affordable 3DTVs forthe home, one of the most important developments has been the introductionof digital video processing technology. Many of the problems associated withprevious 3D booms can be put down to production and projection problems thatare difficult to spot and to fix with the naked eye. Today, these problems have also been solved to a satisfactory level. However, the challenges in 3D video transmission with different networks and its quality at the end have not yet been fully analysed and discussed.
Today the ultimate challenge faced by the service providers is to deliver the maximum 3D video Quality of Experience to end-users with an optimal encoding scheme under transmission constrains such as bandwidth and other limitations. To achieve this, the video services need to be continuously monitored to ensure that users experience them as being of adequate quality. In this tutorial we will discuss the motivations behind these challenges and its importance for future 3D video services. Figure 1 illustrates the 3D Video System Architecture which will be considered in the tutorial.
Figure 1 : 3D Video System Architecture
Outline of the tutorial
1.Brief overview to 3D video
2.3D video capturing/processing and compression
4.Challenges of 3D Video Transmission
Error Resilience and Concealment Techniques
Error Resilience Tools
Forward Error Correction
5.3D Video Transmission: Example Scenarios
3D Video Broadcast over DVB-T
3D Video Broadcast over DVB-S
3D Video Streaming over IP Networks
3D Video Transmission over Mobile Broadband
6.3D Video Quality Assessment
2D Video Quality Metrics
3D Video Quality Analysis
Dr. Anil Fernando (SMIEEE) is a Reader and leads the Video Codec group at the University of Surrey, UK. He has been working in video coding and communications since 1998 and has published more than 250 international refereed journal and proceeding papers in this area. Furthermore, he has published more than 130 international refereed journal and conference papers in multimedia communications. He has contributed to several international projects and currently he is leading 3D video communications work in two large scale projects funded by the European Union on Media communications. Recently he won the IEEE Chester Sall award sponsored by the IEEE Consumer Electronic Society for one of his work on 3D video compression. Most Recent Tutorials (during last 4 years): IEEE ICME 2012, IEEE ICME 2011, IEEE ICME 2010, ICME 2009, ICME 2008, ICME2007, IEEE ICASP 2009, IEEE ICIP 2007.
New Connectors for the New Trend
One of the major challenges facing the consumer electronics industry is the need for ultra-high speed connectors that are insulated from the environment. Standard connector contacts are exposed to the environment giving rise to contact corrosion and signal degradation. Over time these issues have become even more problematic especially in high frequency applications. In this tutorial, one possible solution to this ongoing problem will be presented. It introduces a new connector concept called the Non-Mating Connector (NMC).
The primary motivation behind the development of NMC connectors was to eliminate the need for metal-to-metal ohmic contacts. Ohmic metallic contacts have been used as the primary method of signal transfer since the very beginning of consumer electronics. NMC connectors are different in that they propagate signal data using capacitive and/or magnetic coupling instead of conduction current. This achievement would eliminate the problems associated with internal ohmic contacts and give rise to a connector that is insulated from the environment. It would result in a major breakthrough for consumer electronics.
In this tutorial, proof-of-concept for NMC USB 3.0 connector application will be presented showing excellent performance in comparison to standard USB 3.0 connectors. The experimental setup for the NMC testing is briefly covered. The design and fabrication of actual NMC chips are covered extensively. In short, NMCs hold great promise as waterproof high speed connectors.
Joshua S. Benjestorf received a B.S. degree in Electrical Engineering and a B.A. degree in Applied Mathematics from University of the Pacific. Previously he has worked in the industry for Intel Corporation in Folsom California and Japanese Solderless (JST) terminal in Nagoya Japan before joining NMC Corporation in 2012 where he currently serves as President and CEO. His research interests are in high-speed data connectivity, electromagnetics, energy conservation and robotics. He is a member of the Institute of Electrical and Electronics Engineers (IEEE).
Sunday, January 12, 2014
High-Speed Transceiver Performance of FPGAs in Next-Gen Mobility Applications
Altera FPGAs are an integral component of the interface between the baseband processing section (Radio Equipment Control, or REC) and the RF transmitter/receiver section (Radio Equipment or RE) in many wireless base stations. Where Altera FPGAs are used in these applications, their compliance to the requirements of the Open Base Station Standard Initiative (OBSAI) and the Common Public Radio Interface (CPRI) is vitally important. Altera FPGAs are also used in mobile back haul applications as the interface between the wireless and the wired portions of the mobile network communications infrastructure. In both of these applications, the FPGAs are often required to meet the requirements of the SFF-8431 specification for the enhanced small form factor pluggable module because of the use of optics as the preferred method of interconnecting different pieces of equipment.
Altera FPGAs can enable systems to meet the requirements of OBSAI, CPRI, and SFF-8431 where they apply in base station designs. Altera FPGAs include high-speed transceivers integrated with reconfigurable signal processing circuitry which enables cost-effective system designs. These system designs can take advantage of printed circuit boards made of low-cost materials and can reduce the requirements for additional signal conditioning circuits near the connectors.
The Altera Stratix V and Stratix IV FPGAs are targeted for the requirements of OBSAI, CPRI, and SFF-8431. This tutorial highlights some recent measurement results regarding the compliance of these FPGAs to the requirements of these standards. The tutorial will present measurement methods for evaluating compliance to these specifications and some real-world measurement results related to these specifications. Attendees will be exposed to the measurement methods used to qualify Altera FPGAs to these specifications. These techniques have applications beyond FPGAs. Attendees will also see application examples of the use of FPGAs in the wireless communication infrastructure. These examples will show how Altera FPGAs can provide robust solutions with fast time-to-market for next-generation mobility applications.
John Jones is a Product Engineer in the PMA Characterization Group at Altera Corporation. His primary responsibilities include qualification of Altera’s high-speed transceiver products to industry standards, including SFF-8431. Prior to joining Altera, he was responsible for supporting multiple customers in deploying Gigabit Ethernet systems compliant to the SFF-8431 standard at National Semiconductor Corporation, and then at Texas Instruments, which acquired National Semiconductor Corporation in 2011. Prior to joining National Semiconductor, he was involved with electronic metrology, focusing on microwave and antenna measurements, at Agilent Technologies and Hewlett-Packard, at Scientific-Atlanta, and at Georgia Tech Research Institute.
Mr. Jones holds BEE and MSEE degrees from the Georgia Institute of Technology. He is a past chairman of the Antenna Measurement Techniques Association and holds patents on Compact Antenna Range feed design and on the use of the Discrete Fourier Transform for antenna polarization measurements. He has been a lecturer at the Antenna Measurement Short Course at California State University, Northridge, and at Georgia Tech.
Nonintrusive Appliance Load Monitoring – Opportunities and Challenges
Dr. Michael Zeifman
Non-Intrusive Appliance Load Monitoring (NIALM) refers to a system that estimates electricity consumption of individual appliances using single-point sensing and various disaggregation algorithms. The renewed interest in NIALM in residential setting is due to the wide deployment of smart meters that could be used as the sensors and continued progress in digital computing, sensing and networking. While the original NIALM method required professional installation, modern NIALM prototypes are essentially plug-and-play systems that reside on the cloud or mobile platforms. With estimated penetration of 5-10%, the quickly maturing NIALM technology will bring to the market dedicated consumer electronics devices, mobile applications and even smart home components. This tutorial will review the current state of the art in NIALM, including sensing methods, computational algorithms, feedback types as well as challenges and hurdles.
Dr. Michael Zeifman leads home energy monitoring and modeling work at the Fraunhofer Center for Sustainable Energy Systems (CSE), based in Boston, MA. CSE is part of the international applied research network spearheaded by Germany's Fraunhofer Society. He has given numerous talks on NIALM technology, including invited talks on IEEE conferences and international workshops. Prior to joining Fraunhofer CSE, Dr. Zeifman worked in modeling and simulation for more than fifteen years. He has served as a principal investigator on numerous R&D projects funded either by government (NASA, Department of Defense, NSF) or industry (FM Global, ERC, NYSearch). Dr. Zeifman has authored about 50 peer-reviewed scientific and technical papers. He received his undergraduate degree in Engineering Physics from St. Petersburg State Polytechnic University, Russia, and a M.Sc. in Quality Control and a Ph.D. in Physical Reliability from Technion, the Israeli Institute of Technology. Dr. Zeifman is a Senior Member of both IEEE and AIAA.